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ShenZhen DB Technology.,Ltd
Showing 1 - 10 of 16, total 2 pages [First] [Previous] [
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pcba-117
Specification: PCBA-117
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 9pcs Soldering components:196pcs Minimum component size:0603 Product use:control panel
2
pcba-116
Specification: PCBA-116
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 19pcs Soldering components:152pcs Minimum component size:0603 Product use:control panel Special requirements:BGA
3
pcba-115
Specification: PCBA-115
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 6pcs Soldering components:118pcs Minimum component size:0603 Product use:control panel Special requirements:BGA
4
pcba-114
Specification: PCBA-114
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 16pcs Soldering components:338pcs Minimum component size:0402 Product use:control panel Special requirements:BGA
5
pcba-113
Specification: PCBA-113
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.3mm ROHS complaint No. of IC: 12pcs Soldering components: 198pcs Minimum component size:0805 Product use:control panel Special requirements:
6
pcba-112
Specification: PCBA-112
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.3mm ROHS complaint No. of IC: 23pcs Soldering components: 156pcs Minimum component size:0805 Product use:control panel Special requirements:
7
pcba-111
Specification: PCBA-111
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 33pcs Soldering components: 1766pcs Minimum component size:0402 Product use:control panel Special requirements:BGA
8
pcba-110
Specification: PCBA-110
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.8mm ROHS complaint No. of IC: 6pcs Soldering components: 86pcs Minimum component size:0603 Product use:control panel Special requirements:
9
pcba-109
Specification: PCBA-109
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 33pcs Soldering components: 1966pcs Minimum component size:0402 Product use:control panel Special requirements:BGA
10
pcba-108
Specification: PCBA-108
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 58pcs Soldering components: 6868pcs Minimum component size:0201 Product use:control panel Special requirements:BGA
Showing 1 - 10 of 16, total 2 pages [First] [Previous] [
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